印制电路板的IPC标准目录(一)

　　印制电路板(Printed Circuit Boards)

　　IPC-6010 Series IPC-6010 Qualification and Performance Series

　　IPC-6010印制电路板质量标准和性能规范系列手册

　　IPC-A-600F Acceptability of Printed Boards

　　印制板验收条件

　　IPC-6011 Generic Performance Specification for Printed Boards

　　印制板通用性能规范

　　IEC/PAS 62214 Generic Performance Specification for Printed Boards

　　印制板总体性能规范

　　IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards-Includes Amendment 1

　　刚性印制板的鉴定与性能规范 (包括修改单1)

　　IEC/PAS 62250 Qualification and Performance Specification for Rigid Printed Boards-Includes Amendment 1

　　刚性印制板的鉴定与性能规范

　　IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections

　　有机多芯片?？?MCM-L)安装及互连结构的鉴定与性能规范

　　IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards

　　聚合物厚膜印制板的鉴定与性能

　　IPC-QE-605A Printed Board Quality Evaluation Handbook

　　印制板质量评价

　　IPC-PWB-EVAL-CH Printed Wiring Board Defect Evaluation Chart

　　印制线路板瑕疵评价流程图册

　　IPC-DW-424 General Specification for Encapsulated Discrete Wire Interconnection Boards

　　封入式分立布线互连板通用规范

　　IPC-DW-425A Design and End Product Requirements for Discrete Wiring Boards

　　印制板分立线路的设计及成品要求(包括修改单1)

　　IPC-DW-426 Specification for Assembly of Discrete Wiring 分立线路组装规范

　　IPC-HM-860 Specification for Multilayer Hybrid Circuits 多层混合电路规范

　　IPC-TR-470 Thermal Characteristics of Multilayer Interconnection Boards

　　多层互连板热特性

　　IPC-TR-481 Results of Multilayer Tests Program Round Robin

　　多层印制板联合试验计划结果

　　IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components

　　用于电子元件安装与互连的印制板质量评价

　　IPC-TR-578 Leading Edge Manufacturing Technology Report

　　前沿制造技术报告

　　IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs